課程資訊
課程名稱
 高科技廠房設施營建
High Tech Facility Construction Management 
開課學期
 104-2 
授課對象
 工學院  營建工程與管理組  
授課教師
 張陸滿 
課號
 CIE7139 
課程識別碼
 521 M7270 
班次
  
學分
 3 
全/半年
 半年 
必/選修
 選修 
上課時間
 星期三7,8,9(14:20~17:20) 
上課地點
 土研405 
備註
 限學士班三年級以上
總人數上限：30人 
Ceiba 課程網頁
 http://ceiba.ntu.edu.tw/1042CIE7139_7279 
課程簡介影片
 
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課程概述

Purpose: The purpose of this course is to provide basic knowledge needed for managing a constructed project of high-tech facility. High-Tech includes, not limited to, the advanced technologies applied in the fields of microelectronics, optoelectronics, precision equipment, telecommunication, nanotech, pharmaceutics, biotech, medical devices, animal experiment, and Aerospace. The construction processes undertaken in high-tech manufacturing plants require special clean-build protocols with extremely tight schedule, stringent quality and safety control as well as effective communication for integrating all the participants. The students will learn and experience the processes.

Scope: The focus of this course is on managing high-tech plant construction and engineering its facilities for life-cycle operation. Students will gain methodologies needed to meet ever-changing challenge of delivering an ultra-pure and fast moving semiconductor and related Fabs such as wafer, LED, TFT, and/or Photovoltaic. Moreover, this course will strengthen student’s understanding and background in managing high-tech fab engineering project and integrating its interdisciplinary nature.

This course is intended to offer to both graduate students and undergraduate seniors. Students in engineering, science, pharmacy, and life science will be exposed to fundamental theories and their applications in build/certify/manage the high tech manufacturing plants. Academic faculty will teach basic theories and principles. Professional industrial experts will be invited to cover the application of theories and principles in the real world practices. The contents will include lectures, home works, a semester team project with an oral presentation and a written report, and a final examination. Field trips to visit high-tech plants and research labs, and cleanrooms will be arranged.

Moreover, laboratory experiments will be required to enable students to have hands-on experiences on cleanroom testings. And a short supplemental course by applying TSMC’s 5D CAD to project management will be provided on a volunteer base. And the supplemental course will be examined and certified by TSMC 300mm (12”) wafer Fab Facility Division.
 

課程目標
 The course will enable the students to:
1.Differentiate the typical processes in IC, Photovoltaic and
Bio-medical Fabs.
2.Explain the interdisciplinary nature of high tech Fab construction
3.Perform Site Investigation & Mobilization.
4.Use the basic theories and principles to control Fab Design/Build schedule and perform cost-time trade off.
5.Classify cleanrooms in terms of various international standards.
6.Measure and verify cleanroom.
7.Establish clean-build protocols for constructing and renovating the clean room and other high-tech facilities.
8.Address the issues in automatically integrating the emergency, safety, and security systems.
9.Link to the information sources for further studies in nano/micro fabrication and research.
 
課程要求
 There will be approximate 5~8 home works in spring 2016. Homework counts 20% of “Total Grade.” Students will have to preview class reading assignments. The homework is to answer the questions derived from the reading assignments, lectures, lab experiments, cleanroom tour, or field trips.

There is one (1) group term project. The group term project will be related to high-tech facility and construction management. The term project tests the student's understanding of the principal managerial concepts covered in the course within the context of a comprehensive “real-world” problem. It also provides an opportunity to develop skills for working in a project team context and communication skills. The term project counts 50% of the final grade.

A Final Exam is required on June 22, 2016. The Final Exam will be comprehensive and counted as 15% of “Total Grade.” Group Field Trip Reports (Group work- 3% and Individual work-2%) and another 10% is for class participation.
 
預期每週課後學習時數
  
Office Hours
 另約時間 
指定閱讀
 待補 
參考書目
 1.Chang, C.Y., and Sze, S.M., ULSI Technology, McGraw-Hill Company, Inc., International Edition, 1996, New York.
2.Clifford J. Schexnayder and Richard E. Mayo, Construction Management Fundamentals, McGraw-Hill, New York, 2003, International Edition
3.Food and Drug Administration, Guideline on Sterile Drug Products Produced by Aseptic Processing, FDA, Information Branch, Rockville, Maryland, USA.
4.International Organization for Standards, ISO Standard 14644-4, part 4: Design, Construction, Start up, Geneva, Switzerland, 1999.
5.International Society of Pharmaceutical Engineering, Pharmaceutical Engineering Guide – A Guide for New Facilities, Volume 3: Sterile Manufacturing Facilities, ISPE, 2000.
6.Lurgi, S., Xu, J., and Zaslavsky, A., Future Trends in Microelectronics, Wiley, N.Y, 1999.
7.Mulhall, D., Our Molecular Future: How Nanotechnology, Robotics, Genetics, and Artificial Intelligence Will Transform Our World, Prometheus Books, Amherst, N.Y., 2002.
8.Nishi, Y., Doering, K., and Wooldridge, T., Handbook of Semiconductor Manufacturing Technology, Marcel Dekker, New York, 2000.
9.Oberlender, G. D. Project Management for Engineering and Construction, 2nd Edition, McGraw-Hill, 2000.
10.Project Management Institute (PMI), “A Guide to the Project Management Body of Knowledge,” Newtown Square, PA, USA, 2004.
11.Scherge, M., Biological Micro- and Nanotribiology: Nature’s Solutions, Sprinker, New York, 2001.
12.Van Zant, Peter, Microchip Fabrication: A Practical Guide to Semiconductor Processing, 4th ed., McGraw-Hill, New York, 2000.
13.Whyte. W., Cleanroom Technology: Fundamentals of Design, Testing, and Operation Operation, Chichester, New York, 2001.
14.半導體製造技術，Quirk Serda 著，羅文雄、蔡榮輝 譯 ，滄海（2003）
15.半導體奈米技術，龍文安 著，五南(2006)
16.半導體英語，傳田精一 著，陳連春 譯，建興(2003)
17.高科技廠務，顏登通，全華科技(2008)
 
評量方式
(僅供參考)
    
課程進度
週次
日期
單元主題
第1週
 2/24  Course Introduction and Overview of High-Tech Facility Construction Management 
第2週
 3/02  Fundamentals of Project Planning and CPM Scheduling with Cost Integration 
第3週
 3/09  Construction of High Performance Metrology Area and Engineering Management for the Constructed Project of NTU 7~5 nm Research Lab.  
第4週
 3/16  Introduction of Group Project, Each Facility System and 5D Demo on the Constructed Project of NTU 7~5 nm Research Lab. 
第5週
 3/23  Scheduling thru Microsoft Project and Integration Crystal 5D System with CPM Scheduling and Application of Nanotechnology to Semiconductor Facility Engineering 
第6週
 3/30  Application of Nanotechnology to Semiconductor Facility Engineering and Scheduling thru Line of Balance for Repeated activities. 
第7週
 4/06  Construction Safety and Quality Management Program  
第8週
 4/13  MEP Systems and Construction Management Methods 
第9週
 4/20  No Mid-t4/23: Demolishing and Mobilization, Sub-and-Super Structure Construction, Construction of Isolated Foundation and Structure Bracing for Controlling Vibration and Management of Fab Constructed Project, Tour TSMC (台積電台中廠) Fab15-P5 Cleanroom and Fab15-P6, P7 Construction and
4/23 night: Stay in ITRI Hsinchu campus(工研院新竹院區宿舍)
4/24: Demonstration of 5D, FIM and Control Center, Bases of Scenario Analysis and Integration thru 5D and Group Progress Report with Sponsor’s input (台積電新竹廠 Fab 8 or Fab12). Before heading back to Taipei, a Visit to Mediatek (聯發科新竹總公司) for learning facility and human resource requirements in software industry.
erm Exam, Mandatory Field Trips on 4/23, 4/24 & 5/28 
第10週
 4/27  Cleanroom Construction Methods and Management  
第11週
 5/04  Specialty Systems and Waste Management  
第12週
 5/11  High-purity System Construction (Ultra-pure water, Bulk gas plant) and Management 
第13週
 5/18  Automated Material Handling System, Construction of High Performance Metrology Areas and Group Meeting, 
第14週
 5/25  Nano-Fab Construction Milestones and Methods of Shortening Project Duration and Resource Leveling
To visit AUO Fab (友達光電桃園廠) to Learn TFT-CD Manufacturing Process, EHS management and Zero Waste Management 
第15週
 6/01  Principle and Application Program Evaluation Review Technology (PERT) and Risk Management  
第16週
 6/08  Project Delivery Methods, Total Quality Management or Group Meeting,  
第17週
 6/15  Group Final Term Project Presentation  
第18週
 6/22  Final Exam